Tuesday, April 18, 2006

VIA lands UMPC order from Samsung

Taiwan chip maker VIA Technologies has been selected by Samsung to provide embedded chips for its Microsoft ultra mobile personal computers (UMPCs), according to a report from Digitimes.

Microsoft unveiled its UMPC product idea at the CeBIT IT trade show in March. Microsoft will provide software and general reference designs for the products, which will be about half the size of typical laptops, but different manufacturers will produce the hardware.

The Samsung UMPC will be one of the first to hit the market in the second half of 2006. The device, which is expected to retailer for around $700, will be embedded with VIA'a C7-M microprocessor and VX700 chipset.

According to Digitimes, Samsung decided to go with VIA for its cheaper processors. Though Intel is a major partner in Microsoft's UMPC project, UMPCs based on Intel processors would be nearly twice as expensive as those built on VIA chips.

This is great news for VIA and consumers as there is a real commitment to building affordable UMPC's.


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